Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB

Product Details
Customization: Available
Thermal Conductivity: 1.0-8.0W/M-K
Thickness: 0.3-14.0mm
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  • Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB
  • Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB
  • Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB
  • Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB
  • Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB
  • Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB
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  • Overview
  • Company Profile
  • Our Partners
  • Our Advantages
  • Detailed Photos
  • Typical APPLICATIONS
  • Product Parameters
Overview

Basic Info.

Model NO.
TSP
Density
1.8-5g/Cc
Hardness
10-70 Shore C
Continuous Use Temp
-40 to 300
Breakdown Voltage
5000-7000VAC/mm
UL Flammability Rating
94 V0
Transport Package
Custom
Specification
200*400/330*300/custom
Trademark
TOUSEN
Origin
China
HS Code
35069900
Production Capacity
500000

Packaging & Delivery

Package Size
16.00cm * 16.00cm * 5.00cm
Package Gross Weight
0.500kg

Product Description

Company Profile

     High thermal conductive silicone pad is a high thermal conductivity material.The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material.The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.

Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB
    Guangdong Dongsen Zhichuang Technology Co., Ltd. was established in 2009 with a total registered capital of 11 million Chinese Yuan and more than 200 employees. We have two independent manufactuers located in Huizhou and Jiangxi separately . we also have oversea offices in HK and Japan to provide high-quality services to all our valued customers.
      Our company has passed ISO 9001, ISO1400, IATF16949, OHSAS18001 and other related management system certifications, and our products have got UL\CE\ROHS\REACH and other certifications.
      As a professional manufacturer in the field of thermal interface materials and EMI electromagnetic interference materials, Dongsen mainly provides silicone thermal conductive pads, thermal grease, thermal graphite sheet , thermal conductive tape rolls ,metal foil tapes (copper foil tape, aluminum foil tape), high temperature polyimide tapes, also we provide die cutting customize service as per customers' drawings. We are one of the biggest and most comprehensive solution suppliers of thermal conductivity materials, insulating materials and shielding materials in China.
      Dongsen focuses on meeting customer needs and strives to maximize the profits of customers. We gain trust of various well-known customers, and has long-term cooperation with Samsung, Huawei, ZTE, Changhong, Panasonic, Foxconn, Midea, etc., and has been well received!
Our Partners

Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB

Our Advantages

Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB
Tousen Thermal Interface Material Thermal Pad Conductive Pad Factory Produced Low Thermal Resistance for Laptop LED CPU GPU Die-Cuting

Detailed Photos

Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCBTousen Thermal Interface Material Thermal Pad Conductive Pad for PCB
We have 20 die-cutting production lines, which can die-cut according to customer drawings and provide integrated services(thermal conductive silicone pad die cuting)

Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCBTousen Thermal Interface Material Thermal Pad Conductive Pad for PCBTousen Thermal Interface Material Thermal Pad Conductive Pad for PCB

Typical APPLICATIONS

* High thermal conductivity module
* new energy vehicles
* Microprocessors, memory chips and graphics processors
* Network communication equipment
* Car equipment, charger
* High-speed hard disk drive
* 5G/6G communication module
* Power Battery
* High power LED lights

Tousen Thermal Interface Material Thermal Pad Conductive Pad for PCB

Product Parameters

There are many types of thermal pad, and various parameters can be customized according to customer requirements. Thermal conductivity, thickness, hardness, size, etc. can be processed according to customer requirements, and die-cutting services are provided to meet the packaging needs of various automated production.

The following provides the specifications of the thermal conductivity 8W series products for reference
 

Data Information Unit TSP015 TSP020 TSP025 TSP030  TSP0305 TSP040 TSP050 TSP060 TSP070 TSP080 TSP0010 TSP0012
Thickness mm 0.15~10 0.15~10 0.15~10 0.3~10 0.3~10 0.5~5 0.5~10 0.5~5 0.5~5 0.5~5 0.5~5 0.8~5
Density g/cc 2.1 2.3 2.7 2.9 3 3.1 3.2 3.3 3.4 3.4 3.4 3.4
Thermal Conductivity W/m.k 1.5 2 2.5 3 3.5 4 5 6 7 8 10 12
Standard Hardness Shore 00 40/60 40/60 40/60 40/60 40/60 40/60 40/60 40/60 40/60 40/60 40/60 40/60
Customized Hardness Shore 00 10~90 10~90 10~90 20~90 20~90 30~90 30~90 30~90 30~90 30~90 30~80 30~80
Elongation Rate   50% 50% 40% 40% 30% 30% 30% 30% 20% 15% 15% 15%
Tensile Strength psi 40 40 30 30 30 30 30 30 20 20 10 10
Flame Rating UL 94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Working Temp. ºC -50~200 -50~200 -50~200 -50~200 -50~200 -50~200 -50~200 -50~200 -50~150 -50~150 -50~125 -50~125
Dielectric strength kV/mm >8 >8 >8 >8 >8 >8 >8 >8 >6 >6 >6 >6
Thermal Resistance ºC*in^2/W @30psi,1mm 0.9 0.7 0.5 0.45 0.45 0.4 0.31 0.25 0.18 0.15 0.12 0.1

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